Author:
Suh Bong-Seok,Lee Yoon-Jik,Hwang Jeong-Sug,Park Chong-Ook
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Advanced multilayer metallization schemes with copper as interconnection metal
2. Diffusion of copper through dielectric films under bias temperature stress
3. T. Nakano, H. Ono, T. Ohta, T. Oku, M. Murakami, Proc. 1994 VLSI Multilevel Interconnection Conference, Library of Congress, No.89-644090, 1994, p. 407.
4. H. Mori, J. Inahori, T. Oku, M. Murakami, Proc. Conf. on Stress Induced Phenomena in Metallization: Fourth International Workshop, American Institute of Physics, New York, 1998, p. 475.
5. S.C. Sun, Proc. Conf. on Stress Induced Phenomena in Metallization: Fourth International Workshop, American Institute of Physics, New York, 1998, p. 451.
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