Fracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut® technology
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference15 articles.
1. Application of hydrogen ion beams to Silicon On Insulator material technology;Bruel;Nucl Instrum Method B,1996
2. Basic mechanism involved in the Smart-Cut process;Aspar;Microelectron Engng,1997
3. Mechanics of Smart-Cut(R) technology;Feng;Int J Solids Struct,2004
4. The generic nature of the Smart-Cut process for thin film transfer;Aspar;J Electron Mater,2001
5. Silicon carbide on insulator formation by the Smart-Cut process;Di Ciocco;Mater Sci Engng B,1997
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Tolerance of several construction materials and polycrystalline SiC to blistering and flecking due to ion implantation and annealing;Doklady of the National Academy of Sciences of Belarus;2023-10-31
2. Simulation of crack patterns in quasi-brittle materials under thermal shock using phase field and cohesive zone models;Engineering Fracture Mechanics;2022-12
3. A novel SOI MESFET to spread the potential contours towards the drain;International Journal of Electronics;2020-02-19
4. Reduction in Self-Heating Effect of SOI MOSFETs by Three Vertical 4H-SiC Layers in the BOX;Silicon;2019-06-14
5. Triple tooth AlGaN/GaN HEMT on SiC substrate: A novel structure for high-power applications;Journal of the Korean Physical Society;2017-07-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3