Mechanics of Smart-Cut® technology
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation
Reference57 articles.
1. Basic mechanisms involved in the Smart-Cut® process;Aspar;Microelectron. Eng.,1997
2. Transfer of structured and patterned thin silicon films using the Smart-Cut® process;Aspar;Electron. Lett.,1996
3. Smart-Cut® process using metallic bonding: application to transfer of Si, GaAs, InP thin films;Aspar;Electron. Lett.,1999
4. The generic nature of the Smart-Cut® process for thin film transfer;Aspar;J. Electron. Mater.,2001
5. Smart-Cut(R): the basic fabrication Unibond® SOI wafers;Auberton–Herve;IEICE T Electron. E,1997
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