A study of dry etching-related contaminations on Si and SiO
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Reference9 articles.
1. Dry process technology (reactive ion etching)
2. Preferential SiO2Etching on Si Substrate by Plasma Reactive Sputter Etching
3. Etching Characteristics of Various Materials by Plasma Reactive Sputter Etching
4. Ion‐surface interactions in plasma etching
5. RF Sputter-Etching by Fluoro-Chloro-Hydrocarbon Gases
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