Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel-Reference-Cited by-同舟云学术

Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel

Published:2021-11 Issue: Volume:228 Page:516-522
ISSN:0038-092X
Container-title:Solar Energy
language:en
Short-container-title:Solar Energy

Author:

Basher Hassan,Zulkifli Muhammad Nubli,Rahmat Mohd Khairil,Rahman Muhammad Ghazali Abdul,Jalar Azman,Daenen Michael

Funder

Ministry of Higher Education, Malaysia

Universiti Kuala Lumpur - British Malaysian Institute

Publisher

Elsevier BV

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment

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1. Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. Effect of ultrasonic bonding and lamination on electrical performance of copper indium gallium (de)Selenide CIGS thin film photovoltaic solar panel;Journal of Adhesion Science and Technology;2024-01-11

3. Thermal Stress Impact on Electrical Conductivity and Microstructure of Thin Aluminum Films Deposited on Polyethylene Terephthalate Substrates;IEEE Transactions on Device and Materials Reliability;2023-12

4. Electrical Characterization of Ultrasonic Aluminum Bond on Molybdenum Back Contact of the Thin-Film Solar Module Using Micro-Ohmmeter;Springer Proceedings in Physics;2023

5. Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel;IEEE Journal of Photovoltaics;2022-11