Thermal Stress Impact on Electrical Conductivity and Microstructure of Thin Aluminum Films Deposited on Polyethylene Terephthalate Substrates-Reference-Cited by-同舟云学术

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Thermal Stress Impact on Electrical Conductivity and Microstructure of Thin Aluminum Films Deposited on Polyethylene Terephthalate Substrates

Published:2023-12 Issue:4 Volume:23 Page:494-502
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Hamasha Mohammad M.¹^ORCID,Ali Haneen²^ORCID,Hamasha Sa’d²^ORCID,Masadeh Adnan³

Affiliation:

1. Department of Industrial Engineering, Faculty of Engineering, The Hashemite University, Zarqa, Jordan

2. Department of Industrial and Systems Engineering, Auburn University, Auburn, AL, USA

3. Department of Industrial Engineering, Jordan University of Science and Technology, Irbid, Jordan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/7298/10346019/10233017.pdf?arnumber=10233017

Reference19 articles.

1. Inkjet direct printing approach for flexible electronic

2. Printed flexible thin-film transistors based on different types of modified liquid metal with good mobility

3. Electronic skin: from flexibility to a sense of touch

4. Stability of ITO Thin Film on Flexible Substrate Under Thermal Aging and Thermal Cycling Conditions

5. Effects of mechanical stresses, thickness and atmosphere on aging of polyimide thin films at high temperature

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1. Enhancing flexible electronics: Unveiling the role of strain rate in the performance of molybdenum-coated PET films;Microelectronics Reliability;2024-10

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