Electrical Characterization of Ultrasonic Aluminum Bond on Molybdenum Back Contact of the Thin-Film Solar Module Using Micro-Ohmmeter
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-9267-4_13
Reference16 articles.
1. H. Basher, M.N. Zulkifli, A. Jalar, M. Daenen, Effect of ultrasonic bonding parameters on the contact resistance and bondability performances of CIGS thin film photovoltaic solar panel. IEEE J. Photovoltaics 1–9 (2021). https://doi.org/10.1109/JPHOTOV.2020.3047295
2. T. Xu, O. Valentin, C. Luechinger, Reliable metallic tape connection on CIGS solar cells by ultrasonic bonding.in Thin Film Solar Technology II, vol. 7771 (2010), p. 77710R. https://doi.org/10.1117/12.860962
3. M. Heimann et al., Ultrasonic bonding of aluminum ribbons to interconnect high-efficiency crystalline-silicon solar cells. Energy Procedia 27, 670–675 (2012). https://doi.org/10.1016/j.egypro.2012.07.127
4. T. Geipel et al., Industrialization of Ribbon Interconnection for Silicon Heterojunction Solar Cells with Electrically Conductive Adhesives (2019)
5. T. Geipel, M. Meinert, A. Kraft, U. Eitner, Optimization of electrically conductive adhesive bonds in photovoltaic modules. IEEE J. Photovoltaics 8(4), 1074–1081 (2018). https://doi.org/10.1109/JPHOTOV.2018.2828829
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3