Effect of ultrasonic bonding and lamination on electrical performance of copper indium gallium (de)Selenide CIGS thin film photovoltaic solar panel-Reference-Cited by-同舟云学术

Effect of ultrasonic bonding and lamination on electrical performance of copper indium gallium (de)Selenide CIGS thin film photovoltaic solar panel

Published:2024-01-11 Issue:14 Volume:38 Page:2477-2496
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Basher Hassan¹,Zulkifli Muhammad Nubli¹^ORCID,Jalar Azman²,Daenen Michael³

Affiliation:

1. Renewable Energy Research Laboratory (RENERAL), Electrical Engineering Section, British Malaysia Institute, Universiti Kuala Lumpur, Selangor, Malaysia

2. Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Selangor, Malaysia

3. Faculty of Engineering Technology, Hasselt University, Diepenbeek, Belgium

Funder

the Ministry of Higher Education of Malaysia under the Fundamental Research Grant Scheme

Universiti Kuala Lumpur under Short Term Research Grant

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2024.2303238

Reference33 articles.

1. Xu T Valentin O Luechinger C. Reliable metallic tape connection on CIGS solar cells by ultrasonic bonding. Paper presented at SPIE Solar Energy + Technology Conference. 2010 Aug 1–5; San Diego CA USA.

2. Ultrasonic Bonding of Aluminum Ribbons to Interconnect High-Efficiency Crystalline-Silicon Solar Cells

3. Effects of bonding force on contact pressure and frictional energy in wire bonding

4. Ultrasonic Weldability of Al Ribbon to Cu Sheet and the Dissimilar Joint Formation Mode

5. In situ measurement of bond resistance varying with process parameters during ultrasonic wedge bonding