Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel-Reference-Cited by-同舟云学术

Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel

Published:2022-11 Issue:6 Volume:12 Page:1418-1427
ISSN:2156-3381
Container-title:IEEE Journal of Photovoltaics
language:
Short-container-title:IEEE J. Photovoltaics

Author:

Basher Hassan¹^ORCID,Zulkifli Muhammad Nubli¹^ORCID,Jalar Azman²^ORCID,Daenen Michael³^ORCID

Affiliation:

1. Electrical Engineering Section, Universiti Kuala Lumpur-British Malaysian Institute, Gombak, Malaysia

2. Institute of Microengineering and Nanoelectronic, Universiti Kebangsaan Malaysia, Bangi, Malaysia

3. Faculty of Engineering Technology, Hasselt University, Campus Diepenbeek, Diepenbeek, Belgium

Funder

Ministry of Higher Education, Malaysia

Fundamental Research Grant

Universiti Kuala Lumpur

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503869/9967377/09911181.pdf?arnumber=9911181

Reference43 articles.

1. Effect of encapsulants on the thermomechanical residual stress in the back-contact silicon solar cells of photovoltaic modules – A constrained local curvature model

2. Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination

3. Microstructural Analysis of the Bonding Interface between Thick Al Wire and Al-1 mass%Si Electrode Film

4. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling

5. Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures

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1. Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. Effect of ultrasonic bonding and lamination on electrical performance of copper indium gallium (de)Selenide CIGS thin film photovoltaic solar panel;Journal of Adhesion Science and Technology;2024-01-11

3. Photovoltaics literature survey (no. 182);Progress in Photovoltaics: Research and Applications;2023-03