Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer-Reference-Cited by-同舟云学术

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Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer

Published:2012-10 Issue: Volume:521 Page:146-149
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Moon Dae-Yong,Han Dong-Suk,Park Jae-Hyung,Shin Sae-Young,Park Jong-Wan,Kim Baek Mann,Cho Jun Yeol

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. The International Technology Roadmap for Semiconductor, Interconnect edition,2007

2. Atomic Layer Deposition of Ultrathin Copper Metal Films from a Liquid Copper(I) Amidinate Precursor

3. Hydrogen plasma-enhanced atomic layer deposition of copper thin films

4. Self-forming diffusion barrier layer in Cu–Mn alloy metallization

5. Self-Formed Barrier with Cu-Mn alloy Metallization and its Effects on Reliability

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2. Interfacial Adhesion Energies of Uniformly Self-Formed Cr2O3 Barriers for Advanced Co Interconnects;Electronic Materials Letters;2022-07-20

3. Electrical and Reliability Perspectives for Self-Forming Barrier CuSc Metallization;ECS Journal of Solid State Science and Technology;2021-06-01

4. Atomic layer deposition of transition metal films and nanostructures for electronic and catalytic applications;Critical Reviews in Solid State and Materials Sciences;2020-09-20

5. A New Alternative Electrochemical Process for a Pre-Deposited UPD-Mn Mediated the Growth of Cu(Mn) Film by Controlling the Time during the Cu-SLRR;Coatings;2020-02-11

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