First Demonstration of Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Applications
Author:
Affiliation:
1. 3D Systems Packaging Research Center, School of ECE & MSE, Georgia Institute of Technology,USA
2. Corning Incorporated,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9784154/9783612/09784327.pdf?arnumber=9784327
Reference12 articles.
1. Flexibility matters: high purity, thin, flexible alumina ribbon ceramic;zhuang;Ceramic & Glass Manufacturing,2020
2. Miniaturized High-Performance Filters for 5G Small-Cell Applications
3. Fine line circuit manufacturing technology with electroless copper plating
4. LTCC Multilayered Substrate-Integrated Waveguide Filter With Enhanced Frequency Selectivity for System-in-Package Applications
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3. Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
4. Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications;IEEE Microwave and Wireless Technology Letters;2023-10
5. First Demonstration of Die-embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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