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Fine line circuit manufacturing technology with electroless copper plating

  • Published:1995-03 Issue:1 Volume:18 Page:127-135
  • ISSN:1070-9886
  • Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
  • language:
  • Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Akahoshi H.,Kawamoto M.,Itabashi T.,Miura O.,Takahashi A.,Kobayashi S.,Miyazaki M.,Mutoh T.,Wajima M.,Ishimaru T.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

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