Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications-Reference-Cited by-同舟云学术

Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications

Published:2022-09 Issue:9 Volume:12 Page:1432-1445
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Aslani-Amoli Nahid¹^ORCID,ur Rehman Mutee¹^ORCID,Liu Fuhan¹,Swaminathan Madhavan¹,Zhuang Cheng-Gang²,Zhelev Nikolay Z.³^ORCID,Seok Seong-Ho²,Kim Cheolbok²

Affiliation:

1. 3D Systems Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. Department of Research and Development, Corning Inc., Corning, NY, USA

3. Center for the Applied Physics and Superconducting Technologies and the Department of Physics and Astronomy, Northwestern University, Evanston, IL, USA

Funder

Corning Inc.

Industry Consortium at the 3D Systems Packaging Research Center (PRC), Georgia Tech

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9913798/09851478.pdf?arnumber=9851478

Reference54 articles.

1. High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners

2. Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration

3. Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers

4. Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

5. High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cryogenic Characterization of LTCC Material in Millimeter-Wave Frequencies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. Electrohydrodynamic Inkjet Printed Flexible Ceramic Rectenna for 5.8 GHz ISM Band;2024 IEEE Wireless Power Technology Conference and Expo (WPTCE);2024-05-08

3. Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

4. Implantation of tantalum ions into a dielectric coating synthesized by electron-beam evaporation of aluminum oxide ceramic in the forevacuum pressure range;Vacuum;2023-11

5. Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications;IEEE Microwave and Wireless Technology Letters;2023-10