High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers-Reference-Cited by-同舟云学术

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High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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Author:

Tong Jialing,Sato Yoichiro,Takahashi Shintaro,Imajyo Nobuhiko,Peterson Andrew F,Sundaram Venky,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897621.pdf?arnumber=6897621

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Hardware Solutions for 5G Mobility;3D IC and RF SiPs;2018-03-31

4. Interconnects and Interposer in Porous Anodic Aluminum Oxide: The Fabrication Technology and Process Integration;ECS Journal of Solid State Science and Technology;2018

5. High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper-Metallized Through-Package-Vias (TPVs) in Ultra-Thin Glass Interposers;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

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