Interconnects and Interposer in Porous Anodic Aluminum Oxide: The Fabrication Technology and Process Integration-Reference-Cited by-同舟云学术

Interconnects and Interposer in Porous Anodic Aluminum Oxide: The Fabrication Technology and Process Integration

Published:2018 Issue:8 Volume:7 Page:P385-P390
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Chan Hsiang-Yu^ORCID,Bachman Mark,Li Guann-Pyng

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference27 articles.

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2. 300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application

3. High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers

4. Development of Through Glass Via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging

5. Microelectronics Packaging – As Features Get Smaller, The Role for Lasers Gets Larger;Müller;Commerc. Micro Manuf. Int.,2015

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1. Nanoindentation study of the mechanical properties and deformation behavior of nanoporous alumina films;Journal of Physics: Conference Series;2020-04-01

2. Direct Metal Layer Forming with Good Adhesion on Porous AAO Films by Electroless Cu Plating;Journal of The Electrochemical Society;2019

3. Porous Anodic Aluminum Oxide Interposer: Fabrication, Characterization, and Evaluation;ECS Journal of Solid State Science and Technology;2019