Development of Through Glass Via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging-Reference-Cited by-同舟云学术

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Development of Through Glass Via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Takahashi Shintaro,Horiuchi Kohei,Tatsukoshi Kentaro,Ono Motoshi,Imajo Nobuhiko,Mobely Tim

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575594.pdf?arnumber=6575594

Cited by 38 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV);2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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