Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review

Author:

Lai Yangyang,Pan Ke,Park Seungbae

Publisher

Elsevier BV

Reference71 articles.

1. Flip-chip on glass (FCOG) package for low warpage;McCann,2014

2. FE simulation model for warpage evaluation of glass interposer substrate packages;Shih;IEEE Trans. Compon. Packag. Manuf. Technol.,2021

3. Design, fabrication, and characterization of ultrathin 3-D glass interposers with through-package-vias at same pitch as tSVs in silicon;Sukumaran;IEEE Trans. Compon. Packag. Manuf. Technol.,2014

4. Parametric Study of the Geometry Design of Through-silicon via in Silicon Interposer, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2022-May;Pan,2022

5. The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study;Ahmed;Multidiscip. Model. Mater. Struct.,2021

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