Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications-Reference-Cited by-同舟云学术

Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications

Published:2023-10 Issue:10 Volume:33 Page:1415-1418
ISSN:2771-9588
Container-title:IEEE Microwave and Wireless Technology Letters
language:
Short-container-title:IEEE Microw. Wireless Tech. Lett.

Author:

Aslani-Amoli Nahid¹^ORCID,Rehman Mutee ur¹^ORCID,Vijay Kumar Lakshmi Narasimha¹^ORCID,Moradinia Arya²^ORCID,Liu Fuhan¹^ORCID,Swaminathan Madhavan³,Zhuang Cheng-Gang⁴,Vaddi Rajesh⁴,Seok Seong-Ho⁵,Kim Cheolbok⁴

Affiliation:

1. 3D Systems Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. Georgia Tech Research Institute, Electro-Optical Systems Laboratory, Georgia Institute of Technology, Atlanta, GA, USA

3. Department of Electrical Engineering, Pennsylvania State University, University Park, PA, USA

4. Department of Research and Development, Corning Inc., Corning, NY, USA

5. Corning Technology Center Korea, Corning Inc., Asan, Chungnam, South Korea

Funder

Corning Incorporated

Industry Consortium at the 3-D Systems Packaging Research Center (PRC), Georgia Institute of Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/9944983/10273759/10231006.pdf?arnumber=10231006

Reference38 articles.

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5. Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications

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