First Demonstration of Die-embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications-Reference-Cited by-同舟云学术

First Demonstration of Die-embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Kim Joon Woo¹,Aslani-Amoli Nahid¹,Liu Fuhan²,Vaddi Rajesh³,Nagar Garima C.³,Swaminathan Madhavan⁴

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology,Atlanta,USA

2. 3D Systems Packaging Research Center (PRC), Georgia Institute of Technology,Atlanta,USA

3. Corning Incorporated,Corning,USA

4. Pennsylvania State University State College,Department of Electrical Engineering,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195395.pdf?arnumber=10195395

Reference13 articles.

1. Characterization of poly imide dry film for flexible printed circuit board fabrication;huang;Journal of Materials Science Materials in Electronics,2015

2. Thermal conductivity of low temperature co-fired ceramics (L TCCs) and its application in electronic packaging;bhattacharyya;Journal of Electronic Materials,2010

3. Thermal conductivity of PTFE and PTFE composites;lu;Journal of Applied Polymer Science,2006

4. Thermal conductivity of liquid crystal polymers: a review;chen;Polymers,2017

5. Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

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