Study on processing step uniformity tuning during FET fabrication and sensor wafer response as a function of chuck temperature adjustment
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference33 articles.
1. Microscopic uniformity in plasma etching
2. Simulation of current transients through ultrathin gate oxides during plasma etching
3. Dry Etching of Electronic Oxides, Polymers, and Semiconductors
4. Charging of pattern features during plasma etching
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