Charging of pattern features during plasma etching
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.350241
Reference6 articles.
1. Effect of Potential Field on Ion Deflection and Shape Evolution of Trenches during Plasma‐Assisted Etching
2. Oxygen ion beam etching for pattern transfer
3. Photoresist etching in a hollow cathode reactor
4. Single Silicon Etching Profile Simulation
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