Understanding Early Failure Behavior in 3D-Interconnects: Empirical Modeling of Broadband Signal Losses in TSV-Enabled Interconnects-Reference-Cited by-同舟云学术

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Understanding Early Failure Behavior in 3D-Interconnects: Empirical Modeling of Broadband Signal Losses in TSV-Enabled Interconnects

Published:2022-11 Issue:11 Volume:69 Page:6270-6276
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Coakley Kevin J.¹^ORCID,Kabos Pavel²^ORCID,Moreau stephane³^ORCID,Obeng Yaw S.⁴^ORCID

Affiliation:

1. Information Technology Laboratory, Statistical Engineering Division, National Institute of Standards and Technology, Boulder, CO, USA

2. Physical Measurement Laboratory, Applied Physics Division, National Institute of Standards and Technology, Boulder, CO, USA

3. Univ. Grenoble Alpes, CEA, Leti, Grenoble, France

4. Physical Measurement Laboratory, Nanoscale Characterization Division, National Institute of Standards and Technology, Gaithersburg, MD, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

https://ieeexplore.ieee.org/ielam/16/9926983/9901487-aam.pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. General Analytical Method for Investigating Parasitic Characteristics of Through Glass Vias (TGVs) in 3-D Integration;IEEE Transactions on Electron Devices;2023-09

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