Using a Wireless Temperature Measurement Wafer to Analyze the Cause of Critical Dimension Differences between Tools-Reference-Cited by-同舟云学术

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Using a Wireless Temperature Measurement Wafer to Analyze the Cause of Critical Dimension Differences between Tools

Published:2022-05-02 Issue: Volume: Page:
ISSN:
Container-title:2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Cha Seunguk¹,Rossi Matteo²,Koo Bonwang¹,Jin Kwanghyun³,Jain Vivek⁴

Affiliation:

1. SK Hynix,NAND M14 Photo Technology,Icheon-si,Republic of Korea

2. KLA,SensArray division,Concorezzo,Italy

3. KLA,SensArray division,Hwaseong-si,Republic of Korea

4. KLA,SensArray division,Milpitas,CA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9792471/9792473/09792506.pdf?arnumber=9792506

Reference11 articles.

1. Study of Controlled Oxygen Diffusion Approaches for Advanced Photoresist Strip

2. Oxygen Plasma Photoresist Strip in High Volume HBT Production;wang;CS Mantech Technical Digest,2004

3. Effect of Cooling Rate on Microstructure and Properties of Twin-Roll Casting 6061 Aluminum Alloy Sheet

4. Development of spin-on-carbon hard mask for advanced node;kudo;SPIE Advanced Lithography Proceedings Advances in Patterning Materials and Processes XXXI 9051,2014

5. Etch durable spin-on hard mask

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