Performance of Integrated Cu Gap-Filling Process with Chemical Vapor Deposition Cobalt Liner-Reference-Cited by-同舟云学术

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Performance of Integrated Cu Gap-Filling Process with Chemical Vapor Deposition Cobalt Liner

Published:2013-05-01 Issue:5S3 Volume:52 Page:05FA01
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kokaze Yutaka,Kodaira Shuji,Endo Youhei,Hamaguchi Junichi,Harada Masamichi,Kumamoto Shouichirou,Sakamoto Yuta,Higuchi Yasushi

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference20 articles.

1. Copper Metallization for High Performance Silicon Technology

2. Copper Interconnect Technology

3. Low pressure magnetron sputtering using ionized, sputtered species

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Proximity Effects of the Selective Atomic Layer Deposition of Cobalt on the Nanoscale: Implications for Interconnects;ACS Applied Nano Materials;2021-07-30

2. Area-selective atomic layer deposition of cobalt oxide to generate patterned cobalt films;Journal of Vacuum Science & Technology A;2019-03

3. Atomic layer deposition of cobalt oxide on oxide substrates and low temperature reduction to form ultrathin cobalt metal films;Journal of Vacuum Science & Technology A;2019-01

4. Low Temperature, Selective Atomic Layer Deposition of Cobalt Metal Films Using Bis(1,4-di-tert-butyl-1,3-diazadienyl)cobalt and Alkylamine Precursors;Chemistry of Materials;2017-08-16

5. Electrochemical study on metal corrosion in chemical mechanical planarization process;Japanese Journal of Applied Physics;2017-06-26

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