Electrochemical study on metal corrosion in chemical mechanical planarization process
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/56/i=7S2/a=07KA01/pdf
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1. Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill
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4. BEOL Cu CMP Process Evaluation for Advanced Technology Nodes
5. Cobalt advanced barrier metallization: A resistivity composition analysis
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