Investigation of the relationship between plasma etching characteristics and microstructures of alumina ceramics for chamber parts
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://iopscience.iop.org/article/10.7567/1347-4065/ab022f/pdf
Reference28 articles.
1. Fluorination mechanisms of Al2O3 and Y2O3 surfaces irradiated by high-density CF4∕O2 and SF6∕O2 plasmas
2. Plasma-Resistant Dense Yttrium Oxide Film Prepared by Aerosol Deposition Process
3. Fabrication and plasma resistance properties of transparent YAG ceramics
4. The erosion behaviors of Y2O3 and YF3 coatings under fluorocarbon plasma
5. X-Ray Photoelectron Spectroscopy Study on the Interaction of Yttrium-Aluminum Oxide with Fluorine-Based Plasma
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2. Effect of porosity on etching rate and crater-like microstructure of sintered Al2O3, Y2O3, and YAG ceramics in plasma etching;Ceramics International;2024-05
3. Microstructural characterization and inductively coupled plasma-reactive ion etching resistance of Y2O3–Y4Al2O9 composite under CF4/Ar/O2 mixed gas conditions;Scientific Reports;2024-03-25
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5. Enhancing the Plasma-Resistance Properties of Li2O–Al2O3–SiO2 Glasses for the Semiconductor Etch Process via Alkaline Earth Oxide Incorporation;Materials;2023-07-20
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