Modeling of dual frequency capacitively coupled plasma sources utilizing a full-wave Maxwell solver: II. Scaling with pressure, power and electronegativity-Reference-Cited by-同舟云学术

Modeling of dual frequency capacitively coupled plasma sources utilizing a full-wave Maxwell solver: II. Scaling with pressure, power and electronegativity

Published:2010-09-20 Issue:5 Volume:19 Page:055012
ISSN:0963-0252
Container-title:Plasma Sources Science and Technology
language:
Short-container-title:Plasma Sources Sci. Technol.

Author:

Yang Yang,Kushner Mark J

Publisher

IOP Publishing

Subject

Condensed Matter Physics

Reference15 articles.

1. Control of plasma uniformity in a capacitive discharge using two very high frequency power sources

2. Frequency coupling in dual frequency capacitively coupled radio-frequency plasmas

3. Modeling of radial uniformity at a wafer interface in a 2f-CCP for SiO[sub 2] etching

4. Analysis of a Capacitively Coupled Dual-Frequency CF4Discharge

5. Electromagnetic effects in high-frequency capacitive discharges used for plasma processing

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