Review of profile and roughening simulation in microelectronics plasma etching
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/42/i=19/a=194014/pdf
Reference117 articles.
1. Plasma etching—A discussion of mechanisms
2. Surface-science aspects of plasma-assisted etching
3. Plasma-assisted etching
4. Microscopic uniformity in plasma etching
5. A kinetic study of the plasma‐etching process. I. A model for the etching of Si and SiO2in CnFm/H2and CnFm/O2plasmas
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