Fluxless plasma bumping of lead‐free solders and the reliability effects of under bump metallization thickness-Reference-Cited by-同舟云学术

Fluxless plasma bumping of lead‐free solders and the reliability effects of under bump metallization thickness

Published:2005-06 Issue:2 Volume:17 Page:3-9
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Kwon Moon Joon,Zhou Y.,Pil Jung Jae

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference13 articles.

1. A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique

2. Plasma treatment for fluxless soldering

3. Lead‐free reflow soldering for electronics assembly

4. Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

5. Flux-free direct chip attachment of solder-bump flip chip by Ar + H2 plasma treatment

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3. Enhanced lead-free solder wettability of oxidized-nickel by Ar–H2 plasmas for flip chip bumping;Journal of Materials Science: Materials in Electronics;2015-06-05

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5. Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing;MATERIALS TRANSACTIONS;2005