Plasma treatment for fluxless soldering-Reference-Cited by-同舟云学术

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Plasma treatment for fluxless soldering

Published:2001-07 Issue: Volume:142-144 Page:803-807
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Deltschew R.,Hirsch D.,Neumann H.,Herzog T.,Wolter K.J.,Nowottnick M.,Wittke K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference7 articles.

1. Plasma assisted wave soldering;Scheel,1995

2. Practical Surface Analysis;Briggs,1990

3. High Resolution XPS of Organic Polymers;Beamson,1992

4. Plasma Surface Modification and Plasma Polymerisation;Inagaki,1996

5. Plasma Deposition, Treatment and Etching of Polymers;d'Agostino,1990

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1. The roles of plasma science towards plasma-activated reflow soldering on Cu substrate with organic solderability preservatives surface finish;Surfaces and Interfaces;2022-11

2. Technical Applications;Nonthermal Plasmas for Materials Processing;2022-07-15

3. Achieving Selective Cleaning on Semiconductors Packaging Using Atmospheric Pressure Plasma;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

4. Improving the Solder Wettability Via Atmospheric Plasma Technology;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

5. Comparison of metal oxide removal using hydrogen radicals generated by hot-wire and plasma-enhanced methods;Thin Solid Films;2015-01

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