Comparison of metal oxide removal using hydrogen radicals generated by hot-wire and plasma-enhanced methods-Reference-Cited by-同舟云学术

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Comparison of metal oxide removal using hydrogen radicals generated by hot-wire and plasma-enhanced methods

Published:2015-01 Issue: Volume:575 Page:107-109
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Nogita Kanta,Kamatani Ryosuke,Tayumoto Satoru,Izumi Akira

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. High-lead flip chip bump cracking on the thin organic substrate in a module package

2. Development of fluxes for lead-free solders containing zinc

3. Proceedings of the 10th Symposium on Microelectronics (MES 2000);Nakamura,2000

4. Plasma treatment for fluxless soldering

5. C3F8 plasma fluorination of lead free solders for fluxless soldering

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-01

2. Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

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