Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave-Reference-Cited by-同舟云学术

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Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

Published:2002 Issue:6 Volume:43 Page:1336-1340
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Hong Soon-Min¹,Kang Choon-Sik²,Jung Jae-Pil³

Affiliation:

1. Micro-joining Lab., Institute of Intelligent System, Mechatronics Center, Samsung Electronics Co. Ltd.

2. School of Materials Science & Engineering, Seoul National University

3. Department of Materials Science & Engineering, University of Seoul

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/43/6/43_6_1336/_pdf

Reference17 articles.

1. 1) R. R. Tummala: Fundamentals of Microsystems Packaging, (McGrow-Hill, New York, 2000) p. 544.

2. 2) C. Beddingfield and L. M. Higgins: IEEE Trans. on CPMT Part C, 21 (1998) 189–195.

3. 3) M. Bixenaman and E. Miller: Pro. 5th Int. Joint Symp. on Microelec. and Packaging, (IMAPS-KOREA and IEEE-CPMT, Seoul, Korea) (2000) pp. 43–55.

4. 4) K. J. Wolter, Th. Zerna, R. Deltschew and H. Neumann: 2001 IEEE-ETCT Conference Proceeding, (2001) pp. 1295–1298.

5. 5) N. Koopman, S. Bobbio, S. Nangalia, J. Bousaba and B. Piekarski: 1993 IEEE-ECTC Conference Proceeding, (1993) pp. 595–605.

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1. Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves;Materials Research;2020

2. Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere;Journal of Materials Science;2019-10-30

3. The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking;Journal of Materials Science: Materials in Electronics;2017-07-29

4. Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application;Scripta Materialia;2016-01

5. Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature;Applied Physics Letters;2013-03-04

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