Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference37 articles.
1. Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
2. Recent advances on dielectrics technology for SiC and GaN power devices
3. Power Conversion With SiC Devices at Extremely High Ambient Temperatures
4. P–N junction and metal contact reliability of SiC diode in high temperature (873K) environment
5. Die-attachment solutions for SiC power devices
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