Tellurium implants into GaP at elevated temperatures–Atom site location and damage
Author:
Publisher
Informa UK Limited
Subject
General Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/00337577308232592
Reference10 articles.
1. Whitton, J. L. and Carter, G. Proceedings of Int. Conf on Atomic Collision Phenomena in Solids. Edited by: Palmer, D. W., Thompson, M. W. and Townsend, P. D. pp.615North Holland Publishing Co.
2. ion implantation of bismuth into GaP. I. photoluminescence
3. Implantation and Annealing Behavior of Group III and V Dopants in Silicon as Studied by the Channeling Technique
4. ION IMPLANTATION OF SILICON: I. ATOM LOCATION AND LATTICE DISORDER BY MEANS OF 1.0-MeV HELIUM ION SCATTERING
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1. Ion implantation in III–V compounds;Radiation Effects;1980-01
2. Electrical profiles of magnesium‐ion‐implanted GaP;Journal of Applied Physics;1979-03
3. The application of high-resolution Rutherford backscattering techniques to near-surface analysis;Nuclear Instruments and Methods;1978-02
4. Investigation of ion‐implanted GaP layers by ellipsometry;Journal of Applied Physics;1977-12
5. Nitrogen implantation into GaP: Damage and nitrogen location studies;Journal of Electronic Materials;1975-04
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