Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging
Author:
Affiliation:
1. Electrochemical Microfabrication Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, India
2. Central Manufacturing Technology Institute, Bengaluru, India
Funder
Department of Science and Technology, Ministry of Science and Technology
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/10426914.2022.2105888
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1. Silicon MEMS inertial sensors evolution over a quarter century
2. Piezoelectric MEMS Resonators: A Review
3. Al–SiC ELECTRONIC PACKAGES WITH CONTROLLED THERMAL EXPANSION COEFFICIENT BY A NEW METHOD OF PRESSURELESS INFILTRATION
4. Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology
5. Direct Bonding
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