Direct Bonding
Author:
Publisher
Wiley
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/9783527823239.ch12
Reference36 articles.
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3. Smart‐cut: a new silicon on insulator material technology based on hydrogen implantation and wafer bonding;Bruel M.;Jpn. J. Appl. Phys.,1997
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