An efficient partitioning and placement based fault TSV detection in 3D-IC using deep learning approach
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Computer Science
Link
http://link.springer.com/content/pdf/10.1007/s12652-021-02964-w.pdf
Reference46 articles.
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3. Benabdeladhim M, Fradi A, Hamdi B (2014) New auto-reconfiguration technique for 3D IC with TSV defects. Int J Adv Comput Technol 6(6):14
4. Chang K, Acharya K, Sinha S, Cline B, Yeric G, Lim SK (2017) Impact and design guideline of monolithic 3-D IC at the 7-nm technology node. IEEE Trans VLSI Syst 25(7):2118–2129
5. Chen S, Xu Q, Yu B (2019) Adaptive 3D-IC TSV fault tolerance structure generation. IEEE Trans Comput Aided Des Integr Circuits Syst 38(5):949–960. https://doi.org/10.1109/TCAD.2018.2824284
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