Impact and Design Guideline of Monolithic 3-D IC at the 7-nm Technology Node-Reference-Cited by-同舟云学术

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Impact and Design Guideline of Monolithic 3-D IC at the 7-nm Technology Node

Published:2017-07 Issue:7 Volume:25 Page:2118-2129
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Chang Kyungwook^ORCID,Acharya Kartik,Sinha Saurabh,Cline Brian,Yeric Greg,Lim Sung Kyu

Funder

ARM Inc

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/92/7956364/07892981.pdf?arnumber=7892981

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Airgap Insertion and Layer Reassignment for Timing Optimization Guided by Slack Dependency;Proceedings of the 2024 International Symposium on Physical Design;2024-03-12

2. Design and Tool Solutions for Monolithic Three-Dimensional Integrated Circuits;Handbook of Computer Architecture;2024

3. Design of Low-Power Operation with Sub 7-nm Semiconductor Technology Node;Handbook of Emerging Materials for Semiconductor Industry;2024

4. FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05

5. Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration;2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS);2023-08-06

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