Solder joint reliability of indium-alloy interconnection-Reference-Cited by-同舟云学术

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Solder joint reliability of indium-alloy interconnection

Published:1995-01 Issue:1 Volume:24 Page:39-45
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Shimizu Kozo,Nakanishi Teru,Karasawa Kazuaki,Hashimoto Kaoru,Niwa Koichi

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02659725.pdf

Reference18 articles.

1. K. Seelig et al.,Proc. NEPCON East ’87, June 1987, p. 3.

2. R. Keeler,Electron. Packaging < Production July (1987), p. 45.

3. L.S. Goldmann et al.,Parts, Hybrids, and Packaging No.3, (1977), p. 194.

4. R.T. Howard,IBM J. Res. Develop. 26, (3) 372 (1982).

5. N. Honma et al.,IEICE Trans. E74, (8) (1980).

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