1. Density and thermal expansion of indium–lead melts;Thermophysics and Aeromechanics;2024-02-13
2. Types;Electronic Enclosures, Housings and Packages;2019
3. Underfill Cure Induced Micro-Anomaly (CIMA) and its mechanism and reliability implications;2010 11th International Conference on Electronic Packaging Technology & High Density Packaging;2010-08
4. Fatigue crack propagation behavior of underfill materials in microelectronic packaging;Materials Science and Engineering: A;2001-09
5. Flip-Chip Die Attach Technology;Area Array Interconnection Handbook;2001