Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding-Reference-Cited by-同舟云学术

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Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Kang Dong Gil¹,Deuk Min Kyung¹,Jung Hak San¹,Ha Eun¹,Kim Kyung Yeol¹,Jung Seung-Boo¹

Affiliation:

1. Sungkyunkwan University,School of Advanced Materials Science & Engineering,Suwon,South Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816622.pdf?arnumber=9816622

Reference15 articles.

1. Characterization of eutectic Sn-Bi solder joints

2. Solder joint reliability of indium-alloy interconnection

3. Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

4. IMC Growth and Mechanical Properties of Cu/In-48Sn/Cu Solder Joints

5. Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps with $5\ \mu \mathrm{m}$ Diameters;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling;Materials;2023-04-22

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