Interconnect
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-5053-7_6
Reference100 articles.
1. H. Lee, V. Smet, and R. Tummala, “A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues”, IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 8, No. 1, pp. 239-255, 2019.
2. X. Zhong, L. Chen, B. Medgyes, Z. Zhang, S. Gao, and L. Jakab, “Electrochemical migration of Sn and Sn solder alloys: a review”, RSC Advances, vol. 7, No. 45, pp. 28186-28206, 2017.
3. T. Bakhishev, V. Subramanian, “Investigation of gold nanoparticle inks for low-temperature lead-free packaging technology”, Journal of Electronic Materials, vol. 38, No. 12, pp. 2720-2725, 2009.
4. P. Peng, A. Hu, A. P. Gerlich, G. Zou, L. Liu, Y. N. Zhou, “Joining of silver nanomaterials at low temperatures: processes, properties, and applications”, ACS Applied Materials & Interfaces, vol. 7, No. 23, pp. 12597-12618, 2015.
5. J. Yan, G. Zou, A. Hu, Y. N. Zhou, “Preparation of PVP coated Cu NPs and the application for low-temperature bonding”, Journal of Materials Chemistry, vol. 21, No. 40, pp. 15981-15986, 2011.
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