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Adhesive wafer bonding with photosensitive polymers for MEMS fabrication

  • Published:2009-12-19 Issue:5 Volume:16 Page:799-808
  • ISSN:0946-7076
  • Container-title:Microsystem Technologies
  • language:en
  • Short-container-title:Microsyst Technol

Author:

Cakmak Erkan,Dragoi Viorel,Capsuto Elliott,McEwen Craig,Pabo Eric

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Emerging wafer bonding technologies;Handbook of Silicon Based MEMS Materials and Technologies;2020

2. Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material;The Journal of Engineering;2018-04-12

3. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer;Micromachines;2018-02-25

4. Metrology Needs for 2.5D/3D Interconnects;Handbook of 3D Integration;2014-06-20

5. Bonding Technologies in Manufacturing Engineering;Comprehensive Materials Processing;2014
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