Author:
Alexe M.,Dragoi V.,Reiche M.,Gösele U.
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Reference14 articles.
1. Tong, Q.-Y., and Gösele, U.: ‘Semiconductor wafer bonding’, (John Wiley & Sons New York 1999)
2. Characterization of an individual Si thin layer buried in GaAs (001) using Raman spectroscopy
Cited by
31 articles.
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