Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material
Author:
Affiliation:
1. Graduate School of Engineering, Tottori UniversityTottori 680‐8552Japan
Publisher
Institution of Engineering and Technology (IET)
Subject
General Engineering,Energy Engineering and Power Technology,Software
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/joe.2017.0801
Reference15 articles.
1. Adhesive wafer bonding with photosensitive polymers for MEMS fabrication;Cakmak E.;Microsyst. Technol.,2010
2. Wafer‐level heterogeneous integration for MOEMS, MEMS, and NEMS;Lapisa M.;IEEE J. Sel. Top. Quantum Electron.,2011
3. Three‐dimensional hybrid integration technology of CMOS, MEMS, and photonic circuits for optoelectronic heterogeneous integrated systems;Lee K.‐W.;IEEE Trans. Electron Devices,2011
4. DragoiV. GlinsnerT. MittendorferG.et al.: ‘Adhesive wafer bonding for MEMS applications’.Proc. SPIE 5116 Smart Sensors Actuators and MEMS Canary Islands Spain May 2003 pp.160–167
5. ChouT.‐K. NajafiK.: ‘3D MEMS fabrication using low temperature wafer bonding with benzocyclobutene (BCB)’.Tech. Digest of Transducers 2001 Munich Germany June 2001 pp.1570–1573
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