Progress in material removal mechanisms of surface polishing with ultra precision
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://link.springer.com/content/pdf/10.1007/BF03184299.pdf
Reference54 articles.
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4. Liu, Y. L., Zhang, K. L., Wang, F. et al., Investigation on the final polishing and technique of silicon substrate in ULSI, Microelectronic Engineering, 2003, 66: 438–444.
5. Swetha, T., Arun, K. S., Ashok, K., Tribological issues and modeling of removal rate of low-k films in CMP, J. Electrochem. Soc., 2004, 151: G205-G211.
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