Polishing Approaches at Atomic and Close-to-Atomic Scale

Author:

Geng Zhichao1,Huang Ning1,Castelli Marco1,Fang Fengzhou12ORCID

Affiliation:

1. Centre of Micro/Nano Manufacturing Technology (MNMT-Dublin), University College Dublin, D04 V1W8 Dublin, Ireland

2. State Key Laboratory of Precision Measuring Technology and Instruments, Laboratory of Micro/Nano Manufacturing Technology (MNMT), Tianjin University, Tianjin 300072, China

Abstract

Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes. This review presents polishing approaches at atomic and close-to-atomic scale on planar and curved surfaces, including chemical mechanical polishing, plasma-assisted polishing, catalyst-referred etching, bonnet polishing, elastic emission machining, ion beam figuring, magnetorheological finishing, and fluid jet polishing. These polishing approaches are discussed in detail in terms of removal mechanisms, polishing systems, and industrial applications. The authors also offer perspectives for future studies to address existing and potential challenges and promote technological progress.

Funder

Science Foundation Ireland

State Administration of Foreign Experts Affairs and the Ministry of Education of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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