1. Vacuum evaporation;Glang,1970
2. Ionized magnetron sputtering (I-PVD) for lining and filling trenches and vias at room temperature;Rossnagal,1995
3. Low temperature processing of conformal TiN by ACVD (advanced chemical vapor deposition) for multilevel metallization in high density ULSI Devices;Kang,1998
4. The deposition of silicon dioxide films at low pressure;Adams;J Electrochem Soc,1979
5. A manufacturable ILD gap fill process with biased ECR CVD;Chebi,1991