Fracture mechanics analysis on Smart-Cut® technology. Part 2: Effect of bonding flaws
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Computational Mechanics
Link
http://link.springer.com/content/pdf/10.1007/s10409-008-0193-7.pdf
Reference19 articles.
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3. Aspar B., Moriceau H., Jalaguier E. and Lagahe C. (2001). The generic nature of the Smart-Cut process for thin film transfer. J. Electron. Mater. 30: 834–840
4. Zheng Y., Lau S.S., Hochbauer T., Misra A., Verda R.D. and Mayer J.W. (2001). Orientation dependence of blistering in H-implanted Si. J. Appl. Phys. 89: 2972–2978
5. Hochbauer T., Misra A., Verda R. and Nastasi M. (2000). Hydrogen-induced silicon surface layer exfoliation. Philos. Mag. B 80:1921–1931
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