Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Link
http://link.springer.com/content/pdf/10.1007/s11340-016-0215-5.pdf
Reference20 articles.
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3. Ernst L, Zhang G, Jansen K, Bressers H (2003) Time-and temperature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses. J Electron Packag 125:539–548
4. O’Brien DJ, Sottos N, White SR (2007) Cure-dependent viscoelastic Poisson’s ratio of epoxy. Exp Mech 47:237–249
5. Van Driel W, Janssen J, Zhang G, Yang D, Ernst L (2003) Packaging induced die stresses—effect of chip anisotropy and time-dependent behavior of a molding compound. J Electron Packag 125:520–526
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